10G‑RJ45‑100m Broadcom Chip Module
February 10, 2026
Our company adopts Broadcom PHY chips in mainstream 10G‑RJ45 modules, achieving an excellent balance of high operational stability, low power consumption, and superior thermal performance.
Below are the key features of this product.
The 10G‑T‑RJ45 module (SFP+ 10GBASE‑T) converts an SFP+ interface into an RJ45 electrical port.
It supports Cat6A / Cat7 cables, enabling transmission speeds of up to 10 Gbps over distances of up to 100 meters.
This module is widely used in data centers and enterprise networks.
Internal Module Structure
The module mainly consists of the following components:
Below are the key features of this product.
The 10G‑T‑RJ45 module (SFP+ 10GBASE‑T) converts an SFP+ interface into an RJ45 electrical port.
It supports Cat6A / Cat7 cables, enabling transmission speeds of up to 10 Gbps over distances of up to 100 meters.
This module is widely used in data centers and enterprise networks.
Internal Module Structure
The module mainly consists of the following components:
- RJ45 connector
- 10GBASE‑T high‑speed PHY chip
- AFE and magnetic components
- High‑frequency multilayer PCB
- Metal shielding and thermal dissipation structure
- Internal interconnection material: Gold wire
Gold wire is used in the following areas:
Wire bonding between the bare die of the PHY chip and the package terminals.Internal connections for high‑speed signals, power, and ground.
Advantages of Using Gold Wire
- High electrical conductivity, making it ideal for high‑speed and high‑frequency signal transmission
- Excellent oxidation resistance, ensuring long‑term stable operation
- High bonding reliability and superior heat resistance
- Improved overall signal integrity and increased MTBF (Mean Time Between Failures) of the module
Key Features of the Broadcom Solution
1. Superior Signal Processing PerformanceHigh‑performance echo cancellation and crosstalk suppression
Excellent noise immunity.
Stable 10 Gbps transmission over 100 m Cat6A copper cabling.
2. Outstanding Power Consumption and Thermal Performance
Lower power consumption compared with same‑generation 10G‑T solutions.
Advantages for thermal design within SFP+ modules.
Reduced speed degradation and link instability caused by high‑temperature environments.
Especially suitable for 10G‑T‑RJ45 modules, which are typically prone to higher power consumption.
Summary
By combining gold‑wire bonding technology with the Broadcom 10GBASE‑T PHY solution, the 10G‑T‑RJ45 module delivers high performance, high reliability, and excellent thermal characteristics, making it the mainstream solution for high‑reliability 10G electrical port modules.
Our company provides high‑quality chip solutions and delivers rigorously tested, reliable products at competitive prices.
Please feel free to contact us for further information.